COMPACT FLOOR THERM GRID
Reinforcing mesh for stable, lightweight floors in renovation projects
For direct floor installation on THERM CE and THERM PU
Contact us now COMPACT FLOOR leveling fill overview system planner
T HERM GRID is a 1 mm thick reinforcing fabric with high tensile strength designed to support a 10 mm thick leveling compound. It is applied to the bonded leveling compound COMPACT FLOOR THERM CE or COMPACT FLOOR THERM PU and forms the basis for a stable, smooth, and ready-to-install substrate.
The fabric performs two technical functions:
- It reduces the penetration of the leveling compound into the open-pored fill.
- It reinforces the leveling compound and increases its crack resistance and stability.
The main application is in renovation projects where floors need leveling and a direct floor covering installation is required. The system meets the flatness tolerances for soft floor coverings and designer flooring and is suitable for all types of flooring.
The system can also be combined with E-NERGY CARBON heating films and used as a subfloor for IDEAL systems .
Advantages
- 1 mm thick reinforcing fabric
- High tear resistance for durable layer structures
- Application on COMPACT FLOOR THERM CE or COMPACT FLOOR THERM PU
- To accommodate 10 mm of leveling compound
- Reduces penetration into open-pored fill
- Increased crack resistance and stability
- Smooth surface for demanding paving work
- Suitable for all floor coverings, especially soft floor coverings / designer floors
Quick links
It can be adapted to virtually any surface.
With our online system planner, you can find the right construction for your building project.
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