COMPACT FLOOR THERM PU
Resin-bonded compensating thermal insulation
COMPACT FLOOR THERM PU is a PU resin-bonded expanded glass granulate used as a leveling fill for an uneven floor to create a level and usable surface.
Contact us now COMPACT FLOOR leveling fill overview system planner
COMPACT FLOOR THERM PU is a polyurethane resin-bonded expanded glass granulate used as a leveling compound for uneven floors to create a smooth, walkable surface. It is fast-drying, cement- and water-free, resistant to environmental influences, and permanently dimensionally stable. The integrated thermal insulation enhances the energy efficiency of underfloor heating systems installed above it.
Quick to install and provides excellent thermal insulation. With these properties, COMPACT FLOOR THERM PU for use with underfloor heating systems in dry construction. Thanks to the resin binder, no water is required for installation, and the surface is walkable after just 3 hours.
Even without underfloor heating, COMPACT FLOOR THERM PU offers significant advantages. The resin binder allows for very thin layer thicknesses. COMPACT FLOOR THERM PU can be used with a pouring height as low as 10 mm . The system-specific primer ensures optimal bonding to the substrate.
For information on leveling fill and thermal conductivity layers, please contact us:
Advantages
- Dry assembly without the addition of water
- Layer thicknesses starting from 10 mm
- Good thermal insulation properties of 0.07 W/mK
- High compressive strength of 0.5 N/mm²
It can be adapted to virtually any surface.
With our online system planner, you can find the right construction for your building project.
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